LIPOLY AS200-s Ultra Low Oil-Bleed Thermal Conductive Gel Pad

The LiPOLY AS200-s material is a versatile solution for gap filling, featuring a thermal conductivity of 2.0 W/m*K and a Shore OO/35 hardness for flexibility and compressibility. Its ultra-low oil bleeding properties minimize silicon oil pollutants, ensuring electronic components stay clean and protected. Ideal for various applications requiring reliable thermal management.

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