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You are familiar with the problem of copper migration. But do you also know the best solution? Discover the specially developed alloy LFM-62 from Almit. It is based on a special 3-metal compound with a very high copper content, which limits copper alloying to a minimum. LFM-62 is available as solder ingots and as solid wire without flux core and can be used for a wide range of applications where copper alloying is a problem. Solder bar, Sn-3,0Cu-0,5Ni, 217° – 394°C.
FEATURES
Solder bar, Sn-3,0Cu-0,5Ni.
Fusion point 217° – 394°C.
LFM-62 H Lotbarren/ Solder Bar 1,0kg
Introducing Almit’s innovative solution to copper migration – the LFM-62 alloy. This specially developed compound boasts a high copper content and limits copper alloying. Say goodbye to copper migration issues with this advanced solder, designed to provide optimal performance and reliability in electronic applications.
Danh mục: Almit
Sản phẩm tương tự
Almit
Almit
