Vật tư phòng sạch
L37-3S is an ultra-soft silicone gap filler which has exceptional conformation to surface, a low thermal impedance and high dielectric breakdown voltage. L37-3S can be supplied in various formats ranging from standard sheets to custom die-cut pads in various thicknesses. L37-3S can also be provided with one or two sided thermally conductive adhesive for ease of manufacture.
FEATURES
Very good thermal conductivity
Soft and high compressibility
Natural tack
Easy to assemble
Good insulator
Great reworkability
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.
L37-3S Thermal Conductive Pad
Experience superior thermal management with L37-3S ultra-soft silicone gap filler. Boasting excellent surface conformation, low thermal impedance, and high dielectric breakdown voltage, this versatile filler comes in customizable formats like sheets and die-cut pads of varying thicknesses. Enhance your applications with reliable thermal performance and effortless installation.
Danh mục: T-Global
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