JONES Thermal Pad 21-881

JONES Thermal Pad 21-881 is a highly efficient thermal conductive gap filler with a soft putty-like texture. With a thermal conductivity of 8.0 W/m-K, it easily fills gaps on uneven surfaces for optimal heat dissipation. Ideal for various applications, this product from Vật tư Sunflower ensures superior thermal management performance.

Danh mục:

Liên hệ ngay để có giá tốt nhất

Hotline: 0937664495 (Zalo,Viber)

Chat với chúng tôi