PRODUCT DESCRIPTION
FEATURES of JONES Thermal Pad 21-881
APPLICATIONS of JONES Thermal Pad 21-881
About Vật tư Sunflower
PRODUCT DESCRIPTION
JONES Thermal Pad 21-881 is an ultra soft putty like gap filling material rated at a thermal conductivity of 8.0 W/m-K. It is conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler. Its soft construction offers high conformability and imparts minimum pressure to electronic components.
FEATURES of JONES Thermal Pad 21-881
Thermal Conductivity: 8.0W/m·K
Ultra Soft (Putty Like)
Extremely Good Thermal Performance
Excellent Surface Wetting
High Breakdown Voltage
Easy For Installation
APPLICATIONS of JONES Thermal Pad 21-881
Memory Modules
Mass Storage Devices
Automotive Electronics
Telecommunication Hardware
Radios
Audio And Video Players
IT Infrastructure
About Vật tư Sunflower
Vật tư Sunflower offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply
click here
. Our dedicated team is ready to assist with:
Provide quotation, sample, TDS/MSDS, and technical consultation
Testing sample quality and verifying product compatibility in our laboratory
Customizing material formulas for special applications
Adapting product sizes, quantities, and packaging to meet specific needs
Offering expert advice on suitable equipment and automation processes
Delivering technical training and on-site support for optimal product use
Moreover, Vật tư Sunflower ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation,
please contact us today
.
JONES Thermal Pad 21-881
JONES Thermal Pad 21-881 is a highly efficient thermal conductive gap filler with a soft putty-like texture. With a thermal conductivity of 8.0 W/m-K, it easily fills gaps on uneven surfaces for optimal heat dissipation. Ideal for various applications, this product from Vật tư Sunflower ensures superior thermal management performance.
Thông tin liên hệ
Đảm bảo 100% chất lượng của sản phẩm đúng như yêu cầu từ khách hàng và cung cấp đầy đủ MSDS, TDS, SDS cho từng sản phẩm. Nếu có nhu cầu mua sản phẩm hãy liên hệ đến Sunflower, chúng tôi sẽ hỗ trợ tư vấn nhiệt tình giúp bạn chọn được loại sản phẩm phù hợp.
Trên đây là những thông tin chi tiết về sản phẩm JONES Thermal Pad 21-881 , để được tư vấn và báo giá về sản phẩm, xin vui lòng liên hệ lại ngay với Sunflower theo các thông tin sau:
☎️ Điện thoại: 0966068726 – 0937664495 (zalo)
📧 Email: sale01.sunflowervietnam@gmail.com
🌐 Địa chỉ: 4E Thất Khê, Minh Khai, Hồng Bàng, Hải Phòng
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