FEATURES AND BENEFITS
APPLICATIONS OF JONES 21-745
JONES 21-745, phase change interface thermal material, is designed to maximize heat sink performance and improve component reliability. It minimizes thermal resistance at interfaces and maintains excellent performance when it fills interfacial gaps and voids. At room temperature, JONES PCM 21-745 is solid and easy to handle. This allows it to be consistently and cleanly applied as dry pad to heat sink or component surface. Upon reaching its softening temperature of 50 °C, PCM 21-745 begins to soften and Gow, filling the microscopic irregularities of the component. The result is an interface with minimal bond-line thickness and thermal contact resistance.
FEATURES AND BENEFITS
Low Thermal Resistanc|RoHS Compliant| Phase Change ~ 50 °C|Excellent Interface Wetability|High Reliability|Form:Pad
APPLICATIONS OF JONES 21-745
CPUs (Notebooks,Desktops, Servers)| Chipsets|GPUs| ASICS Chips|Smart Phones|Form:Pad
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Jones Tech JONES 21-745 Thermal Phase Change Material
Enhance your heat sink performance and component reliability with JONES 21-745. This phase change interface thermal material minimizes thermal resistance at interfaces, ensuring optimal heat transfer. Designed to fill interfacial gaps effectively, this product is ideal for various applications that require efficient thermal management for improved performance and reliability.
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