FEATURES AND BENEFITS
APPLICATIONS OF JONES 21-320LD
JONES Thermal Gel 21-320LD is a soft, two-part, extremely high thermal conductivity silicone putty thermal gap filler which could be cured in room temperature. This gap filler is designed to be used where large gap tolerances are present and low mechanical stress on delicate components are needed. It is ideal for filling variable gaps between multiple components and a common heat sink. Specialized rheology allows for easy Gow under pressure.
FEATURES AND BENEFITS
Thermal Conductivity: 2.0 W/m·k
Minimal stress imparted to components during assembly
Easy Rework
Flow Rate: 100 g/min@90psi
Easily Dispensable
Electrically Isolating
Low Thermal Resistance& High Reliability.
APPLICATIONS OF JONES 21-320LD
Cooling components to chassis, frame, or other mating components
Home & Small Office Network
Mass Storage Devices
Automotive Electronics
Telecommunication Hardware
Audio & Video Component.
ABOUT PROSTECH
Vật tư Sunflower provides specialized manufacturing and bonding solutions for a wide range of industries, serving as an authorized distributor of leading global manufacturers of industrial materials and equipment. Our product range is focused and in-depth, with the aim of delivering “customized” solutions tailored to each customer’s specific applications and needs. Browse our full selection of products
here.
Our dedicated technical team is always ready to assist our customers in:
Testing sample quality and verifying product compatibility in our laboratory
Providing expert advice on suitable equipment and automation processes
Customizing material formulas to meet special application requirements
Customizing product sizes, quantities, and packaging according to customer needs
Offering technical training and on-site support to ensure optimal use of our products
Vật tư Sunflower ensure the safe and acurrate delivery of all types of materials, including “dangerous goods,” in compliance with legal regulations.
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Jones Tech JONES 21-320LD Two Part Thermal Gel
Jones 21-320LD Thermal Gel is a high-performance silicone putty thermal gap filler with exceptional thermal conductivity. Ideal for applications with large gap tolerances, this two-part formula cures at room temperature. Enhance heat dissipation in electronic devices with this soft and efficient thermal management solution.
Thông tin liên hệ
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