Vật tư phòng sạch
JONES Thermal Pad 21-881 is an ultra soft putty like gap filling material rated at a thermal conductivity of 8.0 W/m-K. It is conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler.Its soft construction offers high conformability and imparts minimum pressure to electronic components.
FEATURES AND BENEFITS
Thermal Conductivity :8.0W/m·K
Ultra Soft (Putty Like) ｜Extremely Good
Thermal Performance｜Excellent Surface
Thermal Performance｜Excellent Surface
APPLICATION
Memory Modules｜ Mass Storage Devices｜
Automotive Electronics｜Telecommunication
Hardware｜Radios｜Audio And Video Players｜ IT Infrastructure
JONES 21-881 Ultra Soft Thermal Pads
The JONES Thermal Pad 21-881 is a high-performance thermal gap filler with a thermal conductivity of 8.0 W/m-K. Its ultra-soft putty-like material is perfect for filling gaps on uneven surfaces, providing excellent compressibility. This pad’s conformable and soft construction ensures optimal thermal transfer while maintaining durability and reliability.
Danh mục: Jones Tech
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Jones Tech
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Jones Tech
Jones Tech
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Jones Tech