JONES 21-869 Ultra soft thermal pads

FEATURES AND BENEFITS
APPLICATIONS OF JONES 21-869
JONES 21-869 is an ultra soft putty like gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is highly conformable to uneven and rough surfaces, where require the thermal gap filler material has a characteristics of over 50% compressibility. Its soft construction offers high conformability and effectively reduces thermal resistance.
FEATURES AND BENEFITS
Thermal Conductivity :7.0W/m·K
Ultra Soft (Putty Like)
Extremely Good
Thermal Performance
Excellent Surface
Wetting
High Breakdown Voltage
Easy For Installation
APPLICATIONS OF JONES 21-869
Memory Modules
Mass Storage Devices
Automotive Electronics
Telecommunication
Hardware
Radios
Power Electronics
Set-Top Boxes
IT Infrastructure
ABOUT PROSTECH
Vật tư Sunflower provides specialized manufacturing and bonding solutions for a wide range of industries, serving as an authorized distributor of leading global manufacturers of industrial materials and equipment. Our product range is focused and in-depth, with the aim of delivering “customized” solutions tailored to each customer’s specific applications and needs. Browse our full selection of products
here.
Our dedicated technical team is always ready to assist our customers in:
Testing sample quality and verifying product compatibility in our laboratory
Providing expert advice on suitable equipment and automation processes
Customizing material formulas to meet special application requirements
Customizing product sizes, quantities, and packaging according to customer needs
Offering technical training and on-site support to ensure optimal use of our products
Vật tư Sunflower ensure the safe and acurrate delivery of all types of materials, including “dangerous goods,”  in compliance with legal regulations.
Contact us today for quotation!