JONES 21-780 Thermal Phase Change Material

FEATURES AND BENEFITS
APPLICATIONS OF JONES 21-780
JONES 21-780, phase change interface thermal material, is designed to maximize heat sink performance and improve component reliability. It minimizes thermal resistance at interfaces and maintains excellent performance when it fills interfacial gaps and voids. At room  temperature, JONES 21-780 is solid and easy to handle. This allows it to be consistently and cleanly applied as dry pad to heat sink or component surface. Upon reaching its softening temperature of ~50°C, PCM 21-780 begins to soften and Gow, filling the microscopic irregularities of the component. The result is an interface with minimal bond-line thickness and thermal contact resistance.
FEATURES AND BENEFITS
Phase Change ~ 50 °C
Super Low Thermal Resistance
High Thermal Conductivity
Excellent Interface Wetability
High Reliability
Form: Pad
APPLICATIONS OF JONES 21-780
CPUs (Notebooks,Desktops, Servers)
Chipsets
GPUs
ASICS Chips
Smart Phone
ABOUT PROSTECH
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Testing sample quality and verifying product compatibility in our laboratory
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Customizing material formulas to meet special application requirements
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