Chem-Wik Rosin Flux Desoldering Braid 80-BGA-5

Chem-Wik Rosin Flux Desoldering Braid 80-BGA-5 offers the state of the art in desoldering technology. Soder-Wick® is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.
FEATURES
Requires little or no post solder cleaning
No corrosive residues
Optimized weave design for faster wicking and heat transfer
Halide free
Minimal risk of heat damage to components and circuit boards
APPLICATIONS
Thru-hole Components
Surface Mount Device Pads
BGA Pads
Micro Circuits
Terminals
Lugs and Posts
Identification Script