Bostik Thermogrip®H1714

FEATURES of Bostik Thermogrip®H1714
About Vật tư Sunflower
Bostik Thermogrip®H1714 is a low application temperature hot melt adhesive for case forming and sealing applications. H1714 is a product specifically designed to provide very low application temperatures (250°F to 275°F) while still providing fiber-tearing bonds over a wide temperature range on a variety of substrates.
FEATURES of Bostik Thermogrip®H1714
Low application temperature
Clean running
Fiber tearing bonds on a variety of board stocks
About Vật tư Sunflower
Vật tư Sunflower offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply
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. Our dedicated team is ready to assist with:
Provide quotation, sample, TDS/MSDS, and technical consultation
Testing sample quality and verifying product compatibility in our laboratory
Customizing material formulas for special applications
Adapting product sizes, quantities, and packaging to meet specific needs
Offering expert advice on suitable equipment and automation processes
Delivering technical training and on-site support for optimal product use
Moreover, Vật tư Sunflower ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation,
please contact us today
.