BERGQUIST GAP FILLER TGF 3010APS

BERGQUIST GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable gap filler suitable for use in high throughput assembly applications. With a 3.0 W/m-K thermal performance, it provides an excellent silicone-free solution critical to power storage applications using lithium ion batteries. This material is an exceptional choice for use in auto and consumer applications.
Technology
Silicone free
Appearance – Part A
Black
Appearance – Part B
White
Appearance (cured)
Black
Cure
Room temperature cure or Heat cure
Application
Thermal management, Gap Filler (2K)
Mix Ratio by weight: Part A: Part B
1 : 1
Mix Ratio by volume: Part A: Part B
1 : 1
Operating Temperature Range
-40 to 80ºC
Feartures and benefits
● Thermal Conductivity: 3.0 W/m-K
● Dispensable liquid, 2K Silicone free Gap Filler
● Room temperature cure – no oven required
● Extremely high dispense rate: >40 cc/sec
● Low compression stress during assembly