Vật tư phòng sạch
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ Wafer Support Systems (WSS) adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
FEATURES
Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
High instant adhesion to substrate
Good holding power
APPLICATIONS
Wafer De-Taping
3M™ Wafer De-Taping Tape 3305
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with a specialized adhesive for removing 3M™ Wafer Support Systems (WSS) adhesive from device wafers after separating carrier glass from silicon wafers. This tape facilitates stress-free, straightforward, and efficient removal, ensuring smooth wafer processing. Ideal for semiconductor industry applications.
Danh mục: 3M
