Vật tư phòng sạch
3M™ Thermally Conductive Interface Pad 5595 is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.
FEATURES
Provides for good thermal stability of the base polymer with excellent softness of the thermal pad.
Offers good thermal conductivity in a soft silicone polymer base.
The product tack is such that a mechanical means to support the pad in a final assembly is required.
APPLICATIONS
3M™ Thermally Conductive Interface Thermal Pad 5595 is designed to provide a preferential heat-transfer path between heat-generating and cooling devices (e.g., fans, heat pipes and heat sinks).
3M™ Thermally Conductive Interface Pad 5595
The 3M™ Thermally Conductive Interface Pad 5595 facilitates efficient heat transfer between heat-generating parts and cooling devices. With a focus on thermal stability and softness, this interface pad ensures optimal performance by creating a reliable heat-transfer path for enhanced cooling efficiency in electronic devices.
Danh mục: 3M
